Infineon Technologies AG, a German semiconductor manufacturer, and Hon Hai Technology Group, also known as Foxconn, the world’s largest electronics manufacturing services provider based in Taiwan, have announced a partnership in the field of electric vehicles (EV). Both companies aim to jointly develop advanced electro-mobility with efficient and intelligent features to cater to the rapidly growing EV market. The collaboration centers on silicon carbide (SiC) development, which will leverage Infineon’s automotive SiC innovations and Foxconn’s expertise in automotive systems.
As the EV market continues to grow, so does the need for more range and performance. This collaboration aims to meet that demand by advancing and innovating electro-mobility. Peter Schiefer, president of the Infineon Automotive Division, stated, “The development of electro-mobility must continue to advance and innovate,” highlighting the importance of their partnership.
The Memorandum of Understanding (MoU) outlines that both companies will work together on the implementation of SiC technology in automotive high-power applications such as traction inverters, onboard chargers, and DC-DC converters. By combining Infineon’s automotive system understanding, technical support and SiC product offerings with Foxconn’s electronics design and manufacturing expertise, and system-level integration capability, both parties aim to jointly develop EV solutions with outstanding performance and efficiency.
Moreover, Infineon and Foxconn plan to establish a system application center in Taiwan to further expand the scope of their collaboration. This center will focus on optimizing vehicle applications, including smart cabin applications, advanced driver assistance systems (ADAS), and autonomous driving applications. It will also address electro-mobility applications such as battery management systems and traction inverters. This partnership will not only span a wide range of Infineon’s automotive products, including sensors, microcontrollers, power semiconductors, high-performance memories for specific applications, human-machine interface, and security solutions, but it will also help drive the development of the EV industry.
Jun Seki, Foxconn’s chief strategy officer for EVs, believes that this collaboration will result in “optimized architecture, product performance, cost competitiveness, and high system integration to provide customers with the most competitive automotive solutions.” By working together, Infineon and Foxconn can address the growing demand for advanced and efficient electro-mobility solutions.
The system application center is expected to be established within 2023 and will serve as a hub for both companies to collaborate and innovate further. The partnership between Infineon and Foxconn in the field of SiC development marks a significant step towards achieving sustainable and eco-friendly transportation.
