Texas Instruments has started production at its new 300-millimeter wafer fab in Lehi, Utah, known as LFAB, for analog and embedded products, about a year after the company acquired the facility. LFAB is TI’s second 300-millimeter wafer fab to begin semiconductor production in 2022; RFAB2 in Richardson, Texas, began initial production in September.
The fab has more than 275,000 square feet of clean room space. TI’s total investment in the Lehi fab will be about $3 billion to $4 billion over time. TI says LFAB has the capability to support 65-nanometer and 45-nanometer technologies, with the ability to go beyond those nodes as needed. At full production, LFAB will manufacture tens of millions of chips per day.